Friday, December 30, 2016

NXP Semiconductors Jobs Vacancies 2017 Seremban, Negeri Sembilan

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading REAnalog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010.
NXP Semiconductors
Working at NXP is a challenge - the challenge and experience of being part of a dynamic team dealing with cutting edge customer solutions. As an ambitious team of professionals operating in an incredibly exciting industry, we’re always looking for passionate, talented people who will embrace the freedom and challenges we provide. Dedicated professionals that actively push back the boundaries beyond what would normally be expected.

In view of our rapid expansion, we are looking for qualified individuals to join our team for the following positions in our manufacturing plant in Seremban, Negeri Sembilan.

Process Development Senior/Staff Engineer - Molding
Job Responsibilities
* Responsible to characterize and define mold process for new package/ process development.
* Responsible to define process specification for molding process.
* Responsible to understand and resolve process related issue during development phase.

Requirements
* Degree/Master Mechanical Engineering/Material Sciences related or equivalent.
* Minimum 8 to 10 year experience in R&D environment especially in Semiconductor Processes/Development.
* Must be an active practitioner/ hand s-on with various semiconductors mold systems & technologies.

Package Development Senior/Staff Engineer
Job Responsibilities
* Responsible to define and review design specification for new package development.
* Leadframe and Clip characterization and relevant base material analysis for new package development.
* Embrace with suppliers’ latest material technology and develop use of new technology to achieve competitive product outline and cost savings in existing parts.

Requirements
* Possess Degree/Masters/PhD in Mechanical/Materials Engineering discipline
* Minimum of 5 to 8 years working experiences in package development specializing in leadframe designing.
* In depth technical knowledge of leadframes and substrate, understand its symbiosis relationship to other semiconductor packaging materials, process and equipment.

Project Engineer
Job Responsibilities
* Responsible to define the overall project plan in consultation / agreement with all relevant management levels and stakeholders.
* Responsible to implement and realize project targets according to the project plan and within agreed boundaries (specifications, quality, timing, costs, information / reporting and organization).
* Responsible for on time clear and concise reporting and escalation.
* Manage all requested changes and execute change management process.

Requirements
* Bachelor's Degree in Engineering (Electrical / Electronics).
* 8-10 years of experience of project management preferable in semiconductor industry.
* Knowledge in project management & people management.

System & Process Support
Job Responsibilities:
* Responsible for improvements, implementation, support application of systems and procedures on the site.
* Gather user requirements and manage all requested changes and execute change management process.
* To analyze and diagnose problem, develop and implement system solution effectively.

Requirements:
* Degree in Information Technology, Software Engineering with minimum 5 years working experience.
* Strong communication and analytical skills.
* Additional knowledge in SAP, Sales and Distribution module, Material and Resource Control System in Semiconductor industry will be added advantage.

Product & Test Engineer (Power MOS)
Job Responsibilities
* Responsible to identify, troubleshoot and improve test issues to improve yield, productivity, quality and cost.
* Responsible to identify product issues, communicate with business line and work together to resolve the issues.
* Work on product capability and quality improvement through in depth tester understanding & product characterization.
* Manage the handover of product release from Test Development to production test group and support product Safe Launch.

Requirements
* Bachelor’s Degree in Engineering (Electrical/Electronics).
* 2-5 years industrial experience in semiconductors product & test.
* Knowledge in Power MOSFET products & testing, assembly processes (die 8. clip attach), failure analysis and test handlers (ASM & Ismeca).

Cu Wire Development Engineer
Job Responsibilities
* To work closely with Project leader on the Cu wire process development as per project timeline.
* Perform Design of Experiment on the Process Window definition.
* To perform Process characterization using new material.
* To involve on the new platform release.
* To select and define correct material and bonding tools.

Requirement
* Candidate must possess at least a Bachelor’s Degree or Master’s Degree in Engineering or equivalent.
* At least 3-8 year(s) of working experience in Wire Bonding hands-on experience, especially in production or development of Copper Wire Bonding.
* Able to develop Cu wire bonding process on 2 major machine platforms,ASM K&S
* Experienced in running wire bonding process on packages including OFN, leaded package.

Material Engineer
Job Responsibilities
* To closely follow up on the project activities in order to meet committed timeline efficiently manner using project management approach.
* Responsible to validate and release incoming material issue.
* To manage NPI release BOIVI to production.
* Be the resource person and subject matter expert of the factory in the area of focus.
* Work as a team to ensure the achievement of factory set goals.
* To perform incoming material buyoff prior to release to production (Critical BOM only).

Requirement
* Degree in Material Science/Engineering from a recognized institution university.
* 3-8 years industrial experience in Semiconductors Manufacturing Process.
* Knowledgeable and familiar with Bill of Material Characteristic.

New Product Introduction Manager
Job Responsibilities
* Responsible to lead and manage the New Product Introduction team.
* Responsible to work with various Business Group to qualify and release new products.
* Responsible for on time release and ramp up for new product release.

Requirements
* Possess Degree/Masters/PhD in Engineering discipline.
* Min. 10 years of experience of New Product Introduction management preferable in semiconductor industry.
* Knowledge in project management & people management.
* Strong interpersonal skills and conflict management.

Production Technician
Job Responsibilities
* Responsibility of the day to day running of the manufacturing lines to produce high quality products that meet the industry goals and standards.
* This includes operating, troubleshooting and maintaining production equipment.

Requirement
* Diploma in electrical, electronic or mechanical engineering.
* Min 1 years of working experience
* Ability to work on shift rotation.

A very attractive remuneration package to commensurate with experience and qualification will be offered to the success candidates. Are you ready for your next experience?
Kindly submit your resume to nxp.jobs@nxp.com or Write in to

Staffing Department
Human Resources Management
NXP Semiconductors Malaysia Sdn Bhd
PT 12687 Tuanku Jaafar Industrial Park,
71450 Seremban, Negerl Sembllan, Malaysia

Tel : DIS-6766282
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